Audio Dac Amplifier Low-Noise Gold Finger PCB Assembly
- Metal Coating
- Gold
- Mode of Production
- SMT
- Layers
- Multilayer
- Base Material
- FR-4
- Certification
- RoHS, CCC, ISO
- Customized
- Customized
Specifications
| Product name | Audio Dac Amplifier Low-Noise Gold Finger PCB Assembly |
|---|---|
| Category | DACs, USB Audio Adapters & Headphone Amplifiers |
| Customization | Available |
| Metal Coating | Gold |
| Mode of Production | SMT |
| Model NO. | MSZB-0029 |
| Layers | Multilayer |
| Base Material | FR-4 |
| Certification | RoHS, CCC, ISO |
| Customized | Customized |
| Condition | New |
| Transport Package | ESD & Carton Box |
| Specification | Based on Gerber |
| Origin | China |
| HS Code | 8534001000 |
| Production Capacity | 50000PCS / Day |
| Mass production | 394mil(10mm) Samples: 17.5mm |
| Mechanical drill | 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| PCB file | Protel 99SE,P-CAD 2001 PCB |
| BOM | Excel (PDF,word,txt) |
| Price | US$2.00 1-99 Pieces US$1.50 100-999 Pieces US$1.00 1,000+ Pieces |
| Supplier | Mu Star (Shenzhen) Industry Co., Ltd. |
| Data retrieved | 2026-10-23 |
Available options
| Base Material | FR-4 |
|---|
Additional data
| 1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc. |
|---|---|---|
| 2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4 | PCB Max panel size | 1150mm × 560mm |
| 5 | Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
| 6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| 7 | PCBA QC | X-Ray, AOI Test, Functional Test |
| 8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| 9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers |
| 10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| 11 | SMT Capacity | 700 Million Points/Day |
| 12 | DIP Capacity | 5 Million Points/Day |
| 13 | Certificate | CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949 |
Product description
The supplier lists this product. The listed model is MSZB-0029. The specifications below reflect the information publicly displayed on the listing. Model NO.: MSZB-0029. Base Material: FR-4.
Specifications, options and prices reproduce the supplier's published listing. Please confirm critical parameters with us before ordering.
FAQ
What is the minimum order quantity for Audio Dac Amplifier Low-Noise Gold Finger PCB Assembly?
The listed minimum order quantity is 1 pieces. Tell us your quantity in the inquiry form and we will confirm it with the manufacturer.
How much does Audio Dac Amplifier Low-Noise Gold Finger PCB Assembly cost?
The published price is US$1.00 – 2.00 per piece, with lower tier prices for larger quantities. Final pricing depends on quantity, options and destination.
Can it be customized with my logo, color or packaging?
Yes — the listing states that customization is available (Available). Describe your requirements in the inquiry.
Where do these specifications come from?
Specifications, options and prices reproduce the manufacturer's published listing on the date shown in the specification table. Please confirm critical parameters before ordering.
Send an inquiry
MSZB-0029 · US$1.00 – 2.00 · MOQ 1 Pieces
