CONDUCTOR MATERIAL
Palladium-Plated Contact
Specifications
| Short name | Pd |
|---|---|
| Family | Palladium |
| Purity | Pd 99.95% / Ni underplate |
| Manufacturing process | Electroplate over nickel barrier layer |
| Conductivity | 16 % IACS |
| Resistivity | 1.05e-7 Ω·m |
| Tensile strength | 180 MPa |
Overview
Palladium plating over nickel underplate, used on connector contact surfaces in industrial / instrumentation applications. Higher mating-cycle durability than gold; slightly worse conductivity but resistant to contact welding.
Typical uses
- panel-mount connector contacts
- industrial / instrumentation